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Circuit Card Design Engineer Sr

Lockheed MartinOrlando, FLToday
Remotefull-timeSeniorSecret

Description:

You will be the Circuit Card Design Engineer – Microelectronics Packaging for Lockheed Martin’s Missiles & Fire Control division. Our team drives the definition, development, and validation of next generation microelectronics processes, tool flows, and design methodologies for multichip packages. By advancing organic, silicon, active silicon, embedded passive, and miniature inductor substrates, you help deliver the size weight power cost (SWAP C) reductions that keep our missile and fire control systems at the cutting edge.

What You Will Be Doing

As the Circuit Card Design Engineer you will translate high performance circuit card expertise into emerging substrate technologies, create detailed single BGA package designs, and build verification plans that meet stringent Design Assurance standards. You will partner with materials, mechanical, manufacturing, and test groups to ensure packaging solutions flow smoothly from concept to production. Your responsibilities will include:

  • Define requirements, architecture, and design rules for new multichip package technologies (organic, silicon, active silicon, embedded passives, miniature inductors).
  • Develop detailed single BGA package layouts using Siemens Mentor/Xpedition, Cadence Allegro/OrCAD, or Altium Designer and generate complete design data packages.
  • Perform signal and power integrity analyses with SIwave, Ansys Q3D, and PowerSI; run circuit simulations in PSpice, Spectre, or HSPICE to verify performance against specifications.
  • Create and maintain design flow toolchains, verification environments, and automated test scripts that support rapid prototype iteration.
  • Produce technical documentation, standards, and training materials to disseminate best practices across the organization.
  • Conduct trade off studies on substrate choices, stack up configurations, and component footprints to meet SWAP C goals.
  • Lead cross functional reviews with materials, mechanical, manufacturing, and test teams, ensuring packaging designs are manufacturable and meet reliability targets (thermal, shock, vibration).
  • Mentor junior engineers and champion an inclusive, collaborative culture that values diverse perspectives and continuous learning.

Why Join Us

Do you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you.

We offer flexible work schedules to comprehensive benefits investing in your future and security, Learn more about Lockheed Martin’s comprehensive benefits package here.

Further Information About This Opportunity:

This position is in Orlando. Discover more about our Orlando, Florida location.

MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance.

Basic Qualifications:

  • Bachelor of Science in Electrical Engineering (BSEE) or equivalent.
  • 7–12 years of hands-on circuit-card design experience with a proven record of delivering high-performance, reliable products.
  • Demonstrated ability to work independently while influencing and guiding multidisciplinary teams.
  • Strong problem-solving skills and an innovative mindset toward emerging technologies.
  • Excellent written and verbal communication skills for technical documentation and stakeholder presentations.

Desired Skills:

  • Master of Science in Electrical Engineering (MSEE) or related field with exposure to microelectronics or advanced packaging.
  • Experience with signal and power integrity analysis tools (e.g., SIwave, Ansys Q3D, PowerSI).
  • Proficiency in SPICE-based simulation (Pspice, Spectre, HSPICE).
  • Strong command of schematic capture and layout tools such as Siemens Mentor/Xpedition, Cadence Allegro/OrCAD, and Altium Designer.
  • Familiarity with emerging substrate technologies and small-form-factor inductive components.
  • Experience designing multi-chip modules (MCM) or system-in-package (SiP) solutions.
  • Knowledge of reliability testing and industry standards for advanced electronic packaging.

Clearance Level: None

Other Important Information You Should Know

Expression of Interest: By applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match. Should this match be identified you may be contacted for this and future openings.

Ability to Work Remotely: Part-time Remote Telework: The employee selected for this position will work part of their work schedule remotely and part of their work schedule at a designated Lockheed Martin facility. The specific weekly schedule will be discussed during the hiring process.

Work Schedules: Lockheed Martin supports a variety of alternate work schedules that provide additional flexibility to our employees. Schedules range from standard 40 hours over a five day work week while others may be condensed. These condensed schedules provide employees with additional time away from the office and are in addition to our Paid Time off benefits.

Schedule for this Position: 4x10 hour day, 3 days off per week

Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.

The application window will close in 90 days; applicants are encouraged to apply within 5 - 30 days of the requisition posting date in order to receive optimal consideration.

At Lockheed Martin, we use our passion for purposeful innovation to help keep people safe and solve the world's most complex challenges. Our people are some of the greatest minds in the industry and truly make Lockheed Martin a great place to work.

With our employees as our priority, we provide diverse career opportunities designed to propel, develop, and boost agility. Our flexible schedules, competitive pay, and comprehensive benefits enable our employees to live a healthy, fulfilling life at and outside of work. We place an emphasis on empowering our employees by fostering an inclusive environment built upon integrity and corporate responsibility.

If this sounds like a culture you connect with, you’re invited to apply for this role. Or, if you are unsure whether your experience aligns with the requirements of this position, we encourage you to search on Lockheed Martin Jobs, and apply for roles that align with your qualifications.

Experience Level: Experienced Professional

Business Unit: MISSILES AND FIRE CONTROL

Relocation Available: Yes

Career Area: Electrical Engineering

Type: Full-Time

Shift: First

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Job Details
Apply on Company Site
Location
Orlando, FL
Work Model
Remote
Clearance
Secret
Type
full-time
Level
Senior
Experience
7+ years
Posted
Today
Required Skills
BSEE or equivalenthands-on circuit-card design experiencestrong problem-solving skillsexcellent written and verbal communication skills
Preferred Skills
MSEE or related fieldsignal and power integrity analysis toolsSPICE-based simulationschematic capture and layout toolsemerging substrate technologiesmulti-chip modules (MCM) or system-in-package (SiP) solutionsreliability testing and industry standards for advanced electronic packaging
Benefits
  • comprehensive benefits

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